半導(dǎo)體工業(yè)的制造方法是在硅半導(dǎo)體上制造電子元件，而電子元件則由精密復(fù)雜的集成電路所組成，制作過(guò)程主要包括晶圓制備、晶圓制作IC（薄膜制作、微影制程、蝕刻、離子植入）、金屬化制程、打線、封裝與測(cè)試。半導(dǎo)體制程中，半導(dǎo)體材料主要為硅、鍺、砷化鎵等，微影制程中的光阻材料為感光劑、樹脂和溶劑混合而成的感光材料，金屬化制程主要用到絕緣材料和鋁或鋁銅合金，打線過(guò)程主要用到直徑0.025mm左右的金線，最后用環(huán)氧樹脂或陶瓷材料填入封裝。在半導(dǎo)體制程中，集成電路的蝕刻是一個(gè)至關(guān)重要的過(guò)程。伴隨著半導(dǎo)體工業(yè)技術(shù)的發(fā)展以及集成電路中的組件尺寸的精細(xì)化，等離子蝕刻技術(shù)因其可實(shí)現(xiàn)各向異性刻蝕、工藝兼容性好、刻蝕殘存物少等優(yōu)點(diǎn)，在半導(dǎo)體制程等得到越來(lái)越廣泛的應(yīng)用。本公司生產(chǎn)的半導(dǎo)體材料主要為三氟化氮、全氟丁二烯、六氟乙烷、八氟丙烷等氟化物蝕刻氣體。
Semiconductor manufacturing is a process that the electronic component are manufactured on silicon semiconductor, while the electronic components are made up of sophisticated integrated circuit, the process mainly includes manufacture of wafer, manufacture of IC with wafer (manufacture of thin film, photolithography, etching and ion implantation), metallization process, wire bonding, packaging and test. There are some materials used in the process of semiconductor manufacturing, semiconductor materials mainly include silicon, germanium and gallium arsenide. Photoresist used in the photolithography is a kind of photosensitive material which is mixed with photosensitizer, resin and solvent. Insulating material, aluminium and albronze are used in the metallization process, gold thread with diameter of 0.025mm is used in the process of wire bonding. Finally epoxy resin and ceram material are used in the process of packaging. Plasma etching of integrated circuits is a crucial process in semiconductor manufacturing. With the development of semiconductor industry technology and the refinement of component in integrated circuits, plasma etching technology has been widely used in semiconductor manufacturing process due to its advantages such as anisotropic etching, process compatibility and few etching residues. The etching gas manufactured by our company is usually fluoride gas, including nitrogen trifluoride, perfluorobutadiene, hexafluoroethane, octafluoropropane, etc.
